Turkish Journal of Physics

Variation in Thickness of Copper Films Deposited at Various Distances and Angles Using the Thermionic Vacuum Arc
Tamer AKAN, Naci EKEM
Osmangazi University, Physics Department, 26480
Eskisehir-TURKEY
e-mail: akan@ogu.edu.tr; ekem@ogu.edu.tr

Abstract: The thermionic vacuum arc (TVA) is a new technique for the deposition of thin metallic films. Copper depositions were made on glass substrates placed at various distances and angles with respect to the TVA source. By measuring the thickness of the film on each substrate, the variation in the thickness as a function of the distance and angle with respect to the TVA source is investigated.

Key Words: Deposition, anodic vacuum arc, copper vapor plasma, thickness

Turk. J. Phys., 27, (2003), 219-224.
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Other articles published in the same issue: Turk. J. Phys.,vol.27,iss.3.